PSK Inc.

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profiler PROFILER is a new generation Multi-Application system that performs Pattern Profiling and Plasma Oxide Dry Cleaning (POC) utilizing a Point Inductively Coupled Plasma (PICP) source for semiconductor manufacturing under the 3Xnm design processes.

It supports a wide process window utilizing chuck & baffle temperature controls, high & low Etch Rates (50~600 angstrom/min), and good wafer Uniformity (under the 3.0%). Performance, low particle control, and outstanding reliability make the Profiler a highly attractive and effective low-cost solution for various application purposes.

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