DAS series is the latest generation 200mm Ashing and Etching System with increased productivity and it design with the smallest footprint for 200mm System. The system provided high quality process performance, consistency and high precision compared to previous model.
A multi-source Platform is designed for installing Microwave, FCIP or Advanced ICP, depending on the customer's application purpose. RF Bias can be used for both Ashing system (Descum) and Etching application. In addition to DAS series innovative process advancements, Major improvement in system reliability have been achieved through easier HW maintenance and field Proven customized SW. DAS series can be flexible wafer size transfer and process.