SUPRA(Tigma) series is an Ashing System designed with a Low Damage Remote Microwave Plasma Source. The system provides improved throughput, consistency and high precision.The multi-source platform is...
Ecolite series is a simple and economic Low Temperature Ashing System designed with a Low Damage Remote Microwave Plasma Source & Bias Power.The system achieves high ashing rates 2 micor m...
DAS series is the latest generation 200mm Ashing and Etching System with increased productivity and it design with the smallest footprint for 200mm System. The system provided high quality ...
PROFILER is a new generation Multi-Application system that performs Pattern Profiling and Plasma Oxide Dry Cleaning (POC) utilizing a Point Inductively Coupled Plasma (PICP) source for semiconductor...
FUTAS is the future generation Ashing system with H2 gas based plasma source that utilizes high concentration (up to 100%) H2 process gas for optimized polymer removal capability. The new process is critical...
ZIVIS(Integer) is a Plasma Cleaning System for 300mm wafer fabrication. The dry cleaning solution is implemented to overcome the disadvantages of using the wet cleaning process.
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